In order to prepare the surface of the silicon wafer that meets the requirements of the devices and integrated circuits, it must be polished to remove the residual damage layer and obtain a certain thickness of the mirror silicon wafer of the Gaoping whole. Polished mechanical polishing, chemical polishing, electron beam polishing and ion beam polishing are more commonly used in chemical mechanical polishing. Chemical mechanical polishing is a combination of chemical etching and mechanical grinding. It is divided into copper ion polishing, chromium ion polishing and colloidal silicon polishing. Colloidal polishing of silica is made of colloidal polishing solution made of very fine silica powder, sodium hydroxide or organic base and water. During the polishing process, sodium hydroxide and silicon surface reaction natural sodium silicate, through the grinding of silica colloid, sodium silicate into the polishing liquid, the two processes do not stop at the same time to achieve polishing purposes. According to different requirements, one time polishing, two polishing (rough polishing and fine polishing) or three polishing (rough polishing, intermediate polishing and Jing Paoguang) are available. In order to meet the requirements for surface quality and smoothness of VLSI, wax free polishing and polishing without Abrasives have been developed.

         A grinding machine that grinds the surface of a workpiece by applying or inserting abrasive tools. It is mainly used for grinding high precision plane, inside and outside cylindrical surface, conical surface, spherical surface, threaded surface and other surfaces. The main types of lapping machine are disc grinding machine, rotary shaft grinding machine and all kinds of special grinding machines.

①Disc grinder: single disc and double disc two, the most common application is double disc lapping machine.

②Rotary grinding machine: the rotating spindle of the positive and reverse rotation drives the workpiece or the tool (adjustable grinding ring or grinding rod) to rotate. It is simple in structure and is used for grinding inner and outer cylindrical surfaces.

③Special grinding machine: depending on the workpiece being grinded, it has central hole grinding machine, steel ball grinder and gear grinding machine.

In addition, there is a centerless grinding machine similar to centerless grinding for grinding cylindrical workpieces.

The versatile performance of the lapping machine:

1、The polishing machine does not damage the original scale and shape of the parts in the process of vibration polishing and polishing.

2、The polishing function is automatic and easy to operate, and the processing status of parts can be checked at any time in the course of operation.

3、The Fonda double-sided lapping machine selects the world's leading screw rolling activities and the principle of three times oscillations, so that parts and abrasives are mutually grinded to the effect of polishing.

4、A type polisher can take the initiative to separate the abrasive from the workpiece, complete the active material selection, and save labor expenses.

5、The grinding machine is suitable for grinding, polishing and processing large quantities of medium, small and scale parts, making progress several times, saving about 1/3 of the cost.